华润上华

Power IC-1.0um,600V HVIC

1μm600V HVIC

公司提供的1μm 600V HVIC高压浮栅工艺, 拥有200V/600V两个档位的NLDMOS/高压隔离岛。公司的高压互联自屏蔽技术荣获两项发明专利。为电机驱动、白色家电(IPM模块)、大功率LLC、无人机等应用提供了很好的解决方案。

Key Features

- Cost effective mask layer,competitive Rdson and BVdss performance

- Foundry compatible 5V CMOS,20V MV-LDMOS, 200V/600V HVMOS+island

- Rich options included parasitic Zener/JFET

- PDK and industry standard CAD tools are supported

- Supporting Thick metal layer

Application

-Motor driver

-IPM

-LLC

-Unmanned aerial vehicle

1.0μm 60V/120V HVIC

公司提供的1.0μm 60V/120V HVIC工艺, 拥有高可靠性的LDMOS以及精简的光刻层次,提供60V/120V两个档位的N/PLDMOS以及隔离岛。为手持电动工具、平衡车、无人机等应用提供了很好的解决方案。

 Key Features

- Cost effective mask layer,competitive Rdson and BVdss performance

- Foundry compatible 5V CMOS,12V MV-LDMOS, 60V/120V HV-LDMOS and island.

- Rich options included parasitic Zener/JFET

- PDK and industry standard CAD tools are supported

- Supporting Thick metal layer

Application

- Power tools

- Ninebot

-Unmanned aerial vehicle

1.0μm 25V 40V HV

1.0μm 25V 40V HV是公司的标准高压工艺平台之一。是以较少光刻层数实现的经济高压工艺,工艺特征为1.0μm 线宽,单层多晶,双层金属,应用于数模混合的高压产品,工艺平台提供常规及隔离的5V低压CMOS、25V或40V高压CMOS器件,以及多晶高阻和齐纳二极管等器件。

为了节省芯片面积,工艺提供1.0μm 前端0.5μm后端设计规则。

Key Features 

- 5V logic layout & performance compatible with the industry standard

- 1.0 micron front-end, 1.0 micron or 0.5 micron back-end design rule

- Epi process for isolated devices

- Modular concept (HR/ Zener / BJT / Special require)

- Vgs/Vds=5V/25 or Vgs/Vds=5V/40V,Vgs/Vds=25V/25 or Vgs/Vds=40V/40V HVCMOS

- High value poly resistor

- I/O cell library with 2KV HBM ESD protection levels

Application 

- LCD driver/LED driver

- Power management product

- Battery protection IC


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