HHGrace offers an advanced process platform for power management IC including BCD (Bipolar, CMOS and DMOS) and CDMOS process. The BCD/CDMOS process based on HHGrace’s mature CMOS platform can be widely used in different fields such as audio amplifier, indoor and outdoor lighting, power management, industrial control and automotive electronics particularly for DC-DC converters, AC-DC converters, LED lighting and battery management products.
0.35μm BCD (BCD350G/BCD350GE)
- Based on 0.35µm 5V CMOS process, providing high performance BJT and LDMOS with Vgs both 5V & 12V and Vds up to 40V
- Up to four layers of metal interconnects and variety of options including High-Rsh poly resistor, Low-TC poly resistor, MIP capacitor, Schottky diode, Low-TC Zener diode, JFET, 5V/20V/40V depletion NMOS, Low-Vcesat BJT, thick top metal and OTP
- Digital library and fully scalable design kits for flexible design-in
- BCD350GE with enhanced performance and more effective cost by Rdson improvement and mask layers reduction on mature BCD350G
0.18μm BCD (BCD180G)
- Based on 0.18µm 1.8V/5V industry-compatible CMOS process, providing high performance BJT and LDMOS with Vgs 5V and Vds up to 40V
- Up to six layers of metal interconnects and variety of options including High-Rsh poly resistor, Low-TC poly resistor, MIM capacitor, Schottky diode, Low-TC Zener diode, JFET, 5V/20V/40V depletion NMOS, Low Vcesat BJT, thick top metal and OTP/MTP
- Digital library and fully scalable design kits for flexible design-in
0.35μm CDMOS (PMU350G)
- Based on 0.35µm 3.3V/5V CMOS process, providing high performance BJT and LDMOS with Vgs 5V and Vds up to 40V
- Up to four layers of metal interconnections and variety of options including High-Rsh poly resistor, Low-TC poly resistor, MIP capacitor, Low-TC Zener diode, JFET, 5V/20V/40V depletion NMOS, Low Vcesat BJT, thick top metal and OTP
- Digital library and fully scalable design kits for flexible design-in
0.13μm CDMOS
- Based on 0.13µm 1.8V/5V CMOS process, providing high performance LDMOS with Vgs both 5V & 12V and Vds up to 40V
Up to five layers of metal interconnects and variety of options including Hi-Rsh poly resistor, MIM Capacitor, HV BJT, Zener diode and thick top metal
- High reliability eFlash/eEEPROM with more than 10 years data retention and over 200k endurance
- Competitive Rdson with the advantage of chip size reduction
- Digital library, fully scalable design kits, analog and interface IPs for flexible design-in
1μm 700V CDMOS (BCD 700V)
- Based on 1µm 6V CMOS process, providing high performance LDMOS with Vgs 6V and Vds 40V/120V/700V
- Integrated 700V MOSFET, competitive Rdson with the advantage of chip size reduction
- Flexible modular process with related design kit for customers’ layout design, and reduce design cycle
- Rich options of HV JEFT, high-Rsh poly resistor, capacity and Zener diode for flexible design-in
0.8um 5V/40V HVCMOS
- 5V/40V gate voltage, providing 5VCMOS and 40V symmetric and asymmetric structure HVCMOS
- Optional isolation 30V NMOSFET can be used for H-bridged driver
- Offer flexible modular process with design kit, convenient for customers’ layout design, and reduce design cycle
- Rich options of HRPoly ,MIP ,Burried Zener ,Poly fuse, flexible design
- About stable 10 thousands wafer shipment, widely applied for driven of display, PMW and PFC controller of SMPS, LED lighting driver IC
0.5μm/0.35μm 5V CMOS (CZ6H+/CZ6L+) & 0.35μm 7V CMOS (CZ6-7V)
- CZ6H+/CZ6L+ is one of HHGrace's most mature analog process platforms, with more than 10 years experience of mass production. As a result, plenty of IPs is silicon proven. It inherits stable characteristics of logic device, and also offers various options for analog circuit design
- CZ6-7V was another analog technology platform especially for 7V operating voltage, which targeted at product applications of power management chips like low/medium voltage audio amplifier LDO, DC/DC
0.18μm 5V CMOS
- Single poly, up to four layers of metal interconnects
- Competitive mask layers and tight design rules
- Hi-Rsh poly resistor, MIM capacitor, thick top metal, OTP/MTP and other device options
