HHGrace offers standard logic and mixed-signal technology platforms from 0.5μm to 90nm , and their shrink nodes including 0.162μm, 0.153μm (shrink of 0.18μm) and 0.115μm (shrink of 0.13μm).
90nm Low Power Logic and Mixed-Signal
- 1.5V low power core transistor with similar raw gate density of industry 90nm
- Single poly, up to seven layers of metal (Aluminum) interconnects
- The high-density library providing a cost-effective solution in low-power design optimization
- Hi-Rsh poly resistor, MIM capacitor and other device options
0.13μm and Shrink Standard Logic and Mixed-Signal
- Single poly, up to seven layers of metal (Aluminum) interconnects
- 1.2V generic and 1.5V low power core transistors with high-density library and diversified process features
- Standard threshold voltage (Vt) and multi Vt options
- Hi-Rsh poly resistor, MIM capacitor and other device options
0.18μm and Shrink Standard Logic and Mixed-Signal
- Single poly, up to six layers of metal (Aluminum) interconnects
- 1.8V generic and 1.8V low power core transistors with high-density library and diversified process features
- Standard threshold voltage (Vt) and multi Vt options
- Hi-Rsh poly resistor, MIM capacitor and other device options
- Board range of IP supported, including OTP/MTP, common used analog and interface IPs
0.5μm 5V and 0.18μm 3.3V, 5V Mixed-Signal
- Single poly, up to four layers of metal (Aluminum) interconnects
- Competitive mask layers and tight design rules
- Hi-Rsh poly resistor, MIM capacitor, thick top metal, OTP/MTP and other device options
