Technology Overview
Compared to the same device on SMIC's 0.15μm technology, our 0.13μm technology enables a substantial die size reduction of more than 25% and performance enhancement by as much as 30%. The die size can be reduced by more than 50% and chip performance increased by more than 50% when compared to our 0.18μm technology.
SMIC's 0.13μm process technology uses an all-copper interconnect approach to drive high-performance devices while enabling cost optimization. Using eight metal layers with a poly gate length of down to 0.08μm, our 0.13μm technology offers generic devices with a core voltage of 1.2V and I/Os with supply voltage of 2.5V or 3.3V options. Low-voltage and low-leakage options are in mass production.
0.13μm/0.11µm libraries, memory compilers, I/O and analog IP are available directly from SMIC or through our network of library partners
Features
0.13μm/0.11µm Cu platform
Logic Standard Offering
0.13μm
0.11µm
Application Usage
SMIC provides cost-effective and proven solutions at the 0.13μm/0.11μm node for flash controller, media player and various other applications.
