DB HiTek

BCDMOS -BD130LV/40V,BD180MV/45V,BD180LV/40V,BD180X/85V,BD350/60V/85V,UHV700V

BD130LV – 40V Power, 0.13μm BCDMOS

- Foundry compatible 1.5V low power CMOS

- Industry leading NLDMOS and PLDMOS up to 40V

- Implementation of fully Isolated devices is available

- MIM Capacitor, High-Sheet Poly Resistor and Bipolar devices available

- Embedded NVM available

- Standard 1P4M process with up to 8M available

- Fully characterized PDK and industry standard CAD tools are supported

- Thick metal layer or copper plating for power routing

 

BD180MV – 45V Power, 0.18μm BCDMOS

- Foundry compatible 5V CMOS with gate OX TDDB to be guaranteed up to 6V

- Optionally CMOS can be operated on 6V (or max 6.6V) with larger gate length

- Wide SOA and very low Rsp performance LDMOS up to 45V

- Implementation of fully Isolated devices is available

- MIM Capacitor, High-Sheet Poly Resistor and Bipolar devices available

- Standard 1P4M process with up to 6M available

- Fully characterized PDK and industry standard CAD tools are supported

- Thick metal layer or copper plating for power routing


  BD180LV – 40V Power, 0.18μm BCDMOS

- Foundry Compatible 1.8V CMOS

- Industry-leading NLDMOS up to 40V operation

- Implementation of fully Isolated devices is available

- Complementary Drain Extended CMOS (DECMOS) up to 40V operation

- MIM Capacitor and High-Sheet Poly Resistor available

- Embedded NVM available

- Schottky Diode and Bipolar devices available

- Standard 1P4M process, with up to 6M available

- Fully Characterized PDK and Industry Standard CAD Tools Supported

- Thick Metal Layer or Copper Plating for Power Routing

 

BD180X – 85V Power, 0.18μm BCDMOS

- Foundry Compatible 1.8V CMOS

- IDM-competitive Ron for NLDMOS and PLDMOS up to 85V operation

- Implementation of fully isolated devices is available

- Complementary Drain Extended CMOS (DECMOS) up to 85V operation

- MIM Capacitor and High-Sheet Poly Resistor available

- Embedded NVM

- Schottky Diode and Bipolar devices available

- Standard 1P4M process, with up to 6M available

- Fully Characterized PDK and Industry Standard CAD Tools Supported

- Thick Metal Layer or Copper Plating for Power Routing

 

BD350 – 60V or 85V Power, 0.35μm BCDMOS

- 3.3V or 5V logic level

- Complementary DEMOS/LDMOS up to 85V operation

- MIM capacitor and high-sheet poly resistor available

- Embedded NVM available

- NPN and PNP bipolar devices available

- Standard 1P3M process, with 4M optional(Thick Al/Thick Cu available)

- Fully characterized PDK and industry-standard tools

 

Ultra High Voltage BCD process, ‘UHV 700V’

- 0.35μm layout rules and standard 1P2M process, with up to 4M

- 5.5V CMOS

- Fully Scalable 450V/700V nLDMOS (Non-Epi)

- Available single poly process (20V) & double poly process (Vgs=5V, 20V)

- DECMOS, Bipolar and nJFET devices available

- Digital IP / Library set (Std_Cell, EPROM, EEPROM)

- Embedded NVM (EPROM, EEPROM) available without additional mask


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